工艺电压温度敏感的STT-MRAM超低功耗接入策略

Youxiong Zhang, L. Naviner, Hao Cai
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引用次数: 0

摘要

随着电路集成化的发展,低功耗设计已成为片上存储器的设计挑战。本文主要研究STT-MRAM的超低功耗接入策略。高余量电压感测放大器(VSA)基于位线(BL)寄生电容实现,而脉冲检测写入自终止则包括用于MRAM写入。基于28纳米CMOS和40纳米CD磁隧道结(MTJ)进行了仿真。蒙特卡罗仿真结果表明,该传感电路的读取率达到98%以上,与以前的工作相比,节能38%。同时,自终止方案节能80%以上。这些MRAM接入策略能够很好地适应工艺电压-温度(PVT)变化,包括隧道磁电阻(TMR)(20%-200%)、温度(0℃-120℃)和电源电压(0.6V-1.8V)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultra-low Power Access Strategy for Process-Voltage-Temperature Aware STT-MRAM
With the development of circuit integration, low power consumption design has become the design challenge of on-chip memory. This work focuses on ultra-low power access strategy for STT-MRAM. A high margin voltage sensing amplifier (VSA) is implemented based on the bit-line (BL) parasitic capacitance, whereas a pulse-detect write self-termination is included for MRAM writing. Simulation is performed based on 28-nm CMOS and 40-nm CD magnetic tunnel junction (MTJ). Monte Carlo simulation show that the proposed sensing circuit achieves a reading yield of over 98% as well as 38% energy saving compared to previous work. Meanwhile, the self-termination scheme achieves an energy saving for more than 80%. These MRAM access strategies is well-adapted to process-voltage-temperature (PVT) variations including Tunnel Magneto Resistance (TMR) (20%-200%), temperature (0℃-120℃) and supply voltage (0.6V-1.8V).
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