信号经耦合效应导致高频信号部分破碎返回

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI:10.1109/EPEPS.2017.8329737

T. Winkel

{"title":"信号经耦合效应导致高频信号部分破碎返回","authors":"T. Winkel","doi":"10.1109/EPEPS.2017.8329737","DOIUrl":null,"url":null,"abstract":"Chip package to chip package differential signal line measurements were performed to investigate increased via coupling effects. In via fields, the high frequency signal return was spread over different combinations of power and GND vias. Results are discussed for different experiments.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Signal via coupling effects caused by partially broken high frequency signal return\",\"authors\":\"T. Winkel\",\"doi\":\"10.1109/EPEPS.2017.8329737\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Chip package to chip package differential signal line measurements were performed to investigate increased via coupling effects. In via fields, the high frequency signal return was spread over different combinations of power and GND vias. Results are discussed for different experiments.\",\"PeriodicalId\":397179,\"journal\":{\"name\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2017.8329737\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329737","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

芯片封装到芯片封装的差分信号线测量进行了调查增加的耦合效应。在过孔场中，高频信号返回分布在功率和GND过孔的不同组合上。讨论了不同实验的结果。

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Signal via coupling effects caused by partially broken high frequency signal return

Chip package to chip package differential signal line measurements were performed to investigate increased via coupling effects. In via fields, the high frequency signal return was spread over different combinations of power and GND vias. Results are discussed for different experiments.

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来源期刊

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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