用于无铅表面贴装技术的无清洁焊锡膏中克服焊剂残留形成的热成型

L. Buenaflor, S. Dal, I. Estinozo
{"title":"用于无铅表面贴装技术的无清洁焊锡膏中克服焊剂残留形成的热成型","authors":"L. Buenaflor, S. Dal, I. Estinozo","doi":"10.1109/ICEPT.2007.4441442","DOIUrl":null,"url":null,"abstract":"This paper presents the behavior of SnAgCu (SAC) solder paste when analyzed using thermal profiling when exposed to (1) conventional reflow and (2) newly adjusted profiles. Thermal gravimetric analyzer (TGA) was used extensively to study the thermal properties of the flux and to simulate the heating processes the material undergoes during ball-attach reflow process. Experiments have proved that slower ramp rate will allow gradual evaporation of volatiles prior the non-volatile reaction of flux material at soak zone. This understanding of the reaction that takes place prior to soak zone will enable ball-attach engineers to reduce the residue contamination on the ball surface by preventing the amount of solid components to be dragged atop the ball surface during rapid outgassing of solvents at a faster pre-heat ramp rate.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Profiling to Overcome Flux Residue Formation in a No-clean Solder Paste for Lead-free Surface Mount Technology\",\"authors\":\"L. Buenaflor, S. Dal, I. Estinozo\",\"doi\":\"10.1109/ICEPT.2007.4441442\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the behavior of SnAgCu (SAC) solder paste when analyzed using thermal profiling when exposed to (1) conventional reflow and (2) newly adjusted profiles. Thermal gravimetric analyzer (TGA) was used extensively to study the thermal properties of the flux and to simulate the heating processes the material undergoes during ball-attach reflow process. Experiments have proved that slower ramp rate will allow gradual evaporation of volatiles prior the non-volatile reaction of flux material at soak zone. This understanding of the reaction that takes place prior to soak zone will enable ball-attach engineers to reduce the residue contamination on the ball surface by preventing the amount of solid components to be dragged atop the ball surface during rapid outgassing of solvents at a faster pre-heat ramp rate.\",\"PeriodicalId\":325619,\"journal\":{\"name\":\"2007 8th International Conference on Electronic Packaging Technology\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 8th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2007.4441442\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441442","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文介绍了SnAgCu (SAC)焊膏在暴露于(1)常规回流焊和(2)新调整的回流焊时的行为。采用热重分析仪(TGA)对焊剂的热性能进行了研究,并模拟了贴球回流过程中材料的加热过程。实验证明,较慢的斜坡速率可以使助熔剂在浸泡区发生非挥发性反应之前,挥发性物质逐渐蒸发。对浸泡区之前发生的反应的了解,将使粘球工程师能够减少球表面的残留物污染,防止在溶剂快速脱气过程中,以更快的预热斜坡速率将固体成分拖到球表面上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal Profiling to Overcome Flux Residue Formation in a No-clean Solder Paste for Lead-free Surface Mount Technology
This paper presents the behavior of SnAgCu (SAC) solder paste when analyzed using thermal profiling when exposed to (1) conventional reflow and (2) newly adjusted profiles. Thermal gravimetric analyzer (TGA) was used extensively to study the thermal properties of the flux and to simulate the heating processes the material undergoes during ball-attach reflow process. Experiments have proved that slower ramp rate will allow gradual evaporation of volatiles prior the non-volatile reaction of flux material at soak zone. This understanding of the reaction that takes place prior to soak zone will enable ball-attach engineers to reduce the residue contamination on the ball surface by preventing the amount of solid components to be dragged atop the ball surface during rapid outgassing of solvents at a faster pre-heat ramp rate.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信