{"title":"多层PCB板的可靠性、热分析及接线性优化设计","authors":"X. Tian, O. Palusinski","doi":"10.1109/RAMS.2002.981673","DOIUrl":null,"url":null,"abstract":"This paper provides a comprehensive reliability and thermal analysis of a typical multi-layer printed wire board (PWB) wirability design. Based on some typical values of modern PWB designs, numerical solutions are provided for the junction temperature, failure rate, reliability, electrical delay and cost of typical PWBs. Then, an optimization wirability design procedure is provided by using a weighting method. The major design variable is the number of signal layers in PWB and criteria being considered are the cost, reliability and electrical performance. Monographs are provided for different design parameters.","PeriodicalId":395613,"journal":{"name":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Reliability, thermal analysis and optimization wirability design of multi-layer PCB boards\",\"authors\":\"X. Tian, O. Palusinski\",\"doi\":\"10.1109/RAMS.2002.981673\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper provides a comprehensive reliability and thermal analysis of a typical multi-layer printed wire board (PWB) wirability design. Based on some typical values of modern PWB designs, numerical solutions are provided for the junction temperature, failure rate, reliability, electrical delay and cost of typical PWBs. Then, an optimization wirability design procedure is provided by using a weighting method. The major design variable is the number of signal layers in PWB and criteria being considered are the cost, reliability and electrical performance. Monographs are provided for different design parameters.\",\"PeriodicalId\":395613,\"journal\":{\"name\":\"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RAMS.2002.981673\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RAMS.2002.981673","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability, thermal analysis and optimization wirability design of multi-layer PCB boards
This paper provides a comprehensive reliability and thermal analysis of a typical multi-layer printed wire board (PWB) wirability design. Based on some typical values of modern PWB designs, numerical solutions are provided for the junction temperature, failure rate, reliability, electrical delay and cost of typical PWBs. Then, an optimization wirability design procedure is provided by using a weighting method. The major design variable is the number of signal layers in PWB and criteria being considered are the cost, reliability and electrical performance. Monographs are provided for different design parameters.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
