CMS GE1/1系统三gem探测器读出电子器件现状及2017-18年LHC运行切片测试性能

E. Starling
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引用次数: 1

摘要

在这篇文章中,我们将介绍GE1/1系统的三重gem探测器读出电子系统的状态,该系统计划在2019-2020年下一次LS2长停堆期间安装到CMS实验中。我们还将报告自2017年LHC运行以来在CMS μ子端帽中存在的10个切片测试探测器的性能,这是首次在LHC环境中运行如此大型的三重gem探测器,以及2018年3月加入切片测试的v3切片测试探测器的第一批结果。2017年1月,在CMS的μ子端帽上安装了10个切片测试探测器。在2017-2018年的运行中,使用宇宙射线μ子和大型强子对撞机记录了数据。利用从切片测试中吸取的经验教训,可以开发最终的GE1/1 v3电子设备,该电子设备将用于LS2期间安装的生产室。这些新的检测器将在前端由24个运行频率为320 MHz的VFAT3芯片以及v3光混合(OH)板读取。VFAT3芯片的频率比VFAT2芯片高4倍。VFAT3芯片通过1米长的PCB板(称为GEM电子板(GEB))与OH通信,该PCB板经过重新设计以适应更快的VFAT3数字信号。探测器上的电子器件通过10个FEAST DC-DC转换器供电。到后端的光通信,包括包含CTP7和AMC13板的microTCA板条箱,基于CERN通用链路,包括GBT和SCA芯片以及VTRx和VTTx光模块。v3 GE1/1探测器的生产和鉴定目前正在进行中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Status of the Readout Electronics for the Triple-GEM Detectors of the CMS GE1/1 System and Performance of the Slice Test in the 2017-18 LHC Run
In this contribution, we will present the status of the readout electronics system for the triple-GEM detectors of the GE1/1 system, an upgrade which is planned for installation into the CMS experiment during the next LHC long shutdown (LS2) in 2019-2020. We will also report on the performance of the ten slice test detectors which have been present in the CMS muon endcap since the 2017 LHC run, which represent the first time that such large triple-GEM detectors have been operated within the LHC environment, and on the first results from the v3 slice test detectors that were added to the slice test in March 2018. Ten slice test detectors were installed into the CMS muon endcap in January 2017. Data was recorded throughout the 2017-2018 run, using both cosmic ray muons and LHC collisions. Using the lessons learnt from this slice test allowed for the development of the final GE1/1 v3 electronics which will be used on the production chambers to be installed during LS2. These new detectors will be read out on the front-end by 24 VFAT3 chips, which runs at 320 MHz, four times higher than the frequency of the VFAT2 chip, as well as the v3 optohybrid (OH) board. The VFAT3 chips communicate with the OH through a 1m-long PCB, called the GEM electronics board (GEB), which has been re-designed to accommodate the faster VFAT3 digital signals. The on-detector electronics are powered via ten FEAST DC-DC converters. Optical communication to the back-end, which includes a microTCA crate containing CTP7 and AMC13 boards, is based on the CERN Versatile link, including GBT and SCA chips as well as VTRx and VTTx optical modules. Production and qualification of the v3 GE1/1 detectors is currently ongoing.
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