三维微电子集成

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105) Pub Date : 1998-10-21 DOI:10.1109/ICSICT.1998.786099

R. Bower

{"title":"三维微电子集成","authors":"R. Bower","doi":"10.1109/ICSICT.1998.786099","DOIUrl":null,"url":null,"abstract":"A variety of technologies have been applied to the formation of three-dimensional microstructures in the past two decades. In this talk the author describes work in his group to form three-dimensional structures using direct bonding and smart cut techniques.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"3-dimensional microelectronic integration\",\"authors\":\"R. Bower\",\"doi\":\"10.1109/ICSICT.1998.786099\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A variety of technologies have been applied to the formation of three-dimensional microstructures in the past two decades. In this talk the author describes work in his group to form three-dimensional structures using direct bonding and smart cut techniques.\",\"PeriodicalId\":286980,\"journal\":{\"name\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT.1998.786099\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.786099","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在过去的二十年里，各种各样的技术被应用于三维微观结构的形成。在这次演讲中，作者描述了他的团队使用直接键合和智能切割技术形成三维结构的工作。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

3-dimensional microelectronic integration

A variety of technologies have been applied to the formation of three-dimensional microstructures in the past two decades. In this talk the author describes work in his group to form three-dimensional structures using direct bonding and smart cut techniques.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)

自引率

0.00%

发文量