Haoran Li, Baoguo Zhang, Ye Li, Xiaofan Yang, Wei Wei, Zhaoxia Yang
{"title":"PASP缓蚀剂对Cu-Co电偶腐蚀的影响","authors":"Haoran Li, Baoguo Zhang, Ye Li, Xiaofan Yang, Wei Wei, Zhaoxia Yang","doi":"10.1109/CSTIC52283.2021.9461577","DOIUrl":null,"url":null,"abstract":"After integrated circuit feature size is down to 14 nm and under, Co has gradually replaced Ta as an effective barrier layer material. But due to large standard potential difference between Cu and Co, severe galvanic corrosion happens in the Co-Cu interface. The effect of polyaspartic acid (PASP) on Cu/Co galvanic corrosion in alkaline condition was discussed. The results showed that PASP could improve the Material removal rate (MRR) of Cu and reduce the galvanic corrosion between Cu and Co. The corrosion potential difference of Cu/Co was less than 20 mV. In this paper, the mechanism of galvanic corrosion and inhibition was discussed. The new green biodegradable corrosion inhibitor could be a potential candidate in barrier slurry formulation.","PeriodicalId":186529,"journal":{"name":"2021 China Semiconductor Technology International Conference (CSTIC)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of PASP Inhibitor on Cu-Co Galvanic Corrosion\",\"authors\":\"Haoran Li, Baoguo Zhang, Ye Li, Xiaofan Yang, Wei Wei, Zhaoxia Yang\",\"doi\":\"10.1109/CSTIC52283.2021.9461577\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"After integrated circuit feature size is down to 14 nm and under, Co has gradually replaced Ta as an effective barrier layer material. But due to large standard potential difference between Cu and Co, severe galvanic corrosion happens in the Co-Cu interface. The effect of polyaspartic acid (PASP) on Cu/Co galvanic corrosion in alkaline condition was discussed. The results showed that PASP could improve the Material removal rate (MRR) of Cu and reduce the galvanic corrosion between Cu and Co. The corrosion potential difference of Cu/Co was less than 20 mV. In this paper, the mechanism of galvanic corrosion and inhibition was discussed. The new green biodegradable corrosion inhibitor could be a potential candidate in barrier slurry formulation.\",\"PeriodicalId\":186529,\"journal\":{\"name\":\"2021 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-03-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC52283.2021.9461577\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC52283.2021.9461577","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of PASP Inhibitor on Cu-Co Galvanic Corrosion
After integrated circuit feature size is down to 14 nm and under, Co has gradually replaced Ta as an effective barrier layer material. But due to large standard potential difference between Cu and Co, severe galvanic corrosion happens in the Co-Cu interface. The effect of polyaspartic acid (PASP) on Cu/Co galvanic corrosion in alkaline condition was discussed. The results showed that PASP could improve the Material removal rate (MRR) of Cu and reduce the galvanic corrosion between Cu and Co. The corrosion potential difference of Cu/Co was less than 20 mV. In this paper, the mechanism of galvanic corrosion and inhibition was discussed. The new green biodegradable corrosion inhibitor could be a potential candidate in barrier slurry formulation.