A Quantity Evaluation and Reconfiguration Mechanism for Signal- and Power-Interconnections in 3D-Stacking System

Due to the high integration required for system application, the three-dimensional chip may resolve this requirement. The three-dimensional vertically stacking (3D-stacking) systems have been proposed to satisfy these requirements. However, the 3D-stacking system contains several design risks from its long layer interconnections. For a 3D-stacking system, it is difficult to identify where the numerous power and signal-interconnection are open-, shorted-fault, or resistive-short has accrued. Therefore, solving these interconnection problems is necessary. A feasible interconnection quality-evaluation, fault-diagnosis, and connection-reconfigurable mechanism are proposed. The proposed interconnection-measurement-recovery (IMR) mechanism will make it easy to find interconnection faults and make recovery in 3D-Stacking systems. The proposed IMR can detect interconnection open, short, bridge and resistive defects with the path-reroute mechanism. Future more, the signal transmission quality can be measured. This measurement provides to monitor signal propagation in pico-second accuracy. IMR has less extra area and power consumption overhead. The feasibilities of the proposed mechanism have been justified by 2D-chip and 3D-stacking MorPack both systems.