无线体域网络收发器集成电路的并发体耦合供电和通信使用单电极

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) Pub Date : 2023-06-11 DOI:10.23919/VLSITechnologyandCir57934.2023.10185270

Jiamin Li, Yilong Dong, Longyang Lin, Joanne Si Ying Tan, Fong Jia Yi, Jerald Yoo

{"title":"无线体域网络收发器集成电路的并发体耦合供电和通信使用单电极","authors":"Jiamin Li, Yilong Dong, Longyang Lin, Joanne Si Ying Tan, Fong Jia Yi, Jerald Yoo","doi":"10.23919/VLSITechnologyandCir57934.2023.10185270","DOIUrl":null,"url":null,"abstract":"We propose the wireless body-coupled power (BCP) transfer ICs with concurrent body-coupled communication (BCC) via a single electrode. Base Station (BS) IC employs the adaptive Self-Interference Cancellation for >40dB signal suppression and a Charge Replenishing HV driver for 31% power saving. Sensor Node (SN) IC adopts ground-domain separation with 89.1% cross-ground-domain power efficiency. The ICs in 40nm standard CMOS deliver power with concurrent data uplink and downlink to the entire body area.","PeriodicalId":317958,"journal":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wireless Body-Area Network Transceiver ICs with Concurrent Body-Coupled Powering and Communication using Single Electrode\",\"authors\":\"Jiamin Li, Yilong Dong, Longyang Lin, Joanne Si Ying Tan, Fong Jia Yi, Jerald Yoo\",\"doi\":\"10.23919/VLSITechnologyandCir57934.2023.10185270\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose the wireless body-coupled power (BCP) transfer ICs with concurrent body-coupled communication (BCC) via a single electrode. Base Station (BS) IC employs the adaptive Self-Interference Cancellation for >40dB signal suppression and a Charge Replenishing HV driver for 31% power saving. Sensor Node (SN) IC adopts ground-domain separation with 89.1% cross-ground-domain power efficiency. The ICs in 40nm standard CMOS deliver power with concurrent data uplink and downlink to the entire body area.\",\"PeriodicalId\":317958,\"journal\":{\"name\":\"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-06-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185270\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185270","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

我们提出了一种通过单电极实现体耦合通信的无线体耦合功率(BCP)传输集成电路。基站(BS) IC采用自适应自干扰消除，信号抑制>40dB，充电高压驱动器，节电31%。SN (Sensor Node) IC采用地域分离，跨地域功率效率89.1%。采用40nm标准CMOS的ic为整个车身区域提供具有并发数据上行和下行链路的功率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Wireless Body-Area Network Transceiver ICs with Concurrent Body-Coupled Powering and Communication using Single Electrode

We propose the wireless body-coupled power (BCP) transfer ICs with concurrent body-coupled communication (BCC) via a single electrode. Base Station (BS) IC employs the adaptive Self-Interference Cancellation for >40dB signal suppression and a Charge Replenishing HV driver for 31% power saving. Sensor Node (SN) IC adopts ground-domain separation with 89.1% cross-ground-domain power efficiency. The ICs in 40nm standard CMOS deliver power with concurrent data uplink and downlink to the entire body area.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

自引率

0.00%

发文量