A. Belyaev, S. Lulu, I. Tarasov, S. Ostapenko, J. Kalejs
{"title":"基于声学技术的多晶硅片应力诊断","authors":"A. Belyaev, S. Lulu, I. Tarasov, S. Ostapenko, J. Kalejs","doi":"10.1109/PVSC.2002.1190526","DOIUrl":null,"url":null,"abstract":"Residual stress is generated in silicon crystals during growth of material for use as substrates for solar cells. This stress affects yield in processing the wafers into cells and modules. We report here on the application of a resonance acoustic method, used previously to measure stress in CZ silicon wafers, to characterize multicrystalline EFG silicon ribbon wafers.","PeriodicalId":177538,"journal":{"name":"Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002.","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Stress diagnostics in multicrystalline silicon wafers using an acoustic technique\",\"authors\":\"A. Belyaev, S. Lulu, I. Tarasov, S. Ostapenko, J. Kalejs\",\"doi\":\"10.1109/PVSC.2002.1190526\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Residual stress is generated in silicon crystals during growth of material for use as substrates for solar cells. This stress affects yield in processing the wafers into cells and modules. We report here on the application of a resonance acoustic method, used previously to measure stress in CZ silicon wafers, to characterize multicrystalline EFG silicon ribbon wafers.\",\"PeriodicalId\":177538,\"journal\":{\"name\":\"Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002.\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-05-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PVSC.2002.1190526\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC.2002.1190526","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Stress diagnostics in multicrystalline silicon wafers using an acoustic technique
Residual stress is generated in silicon crystals during growth of material for use as substrates for solar cells. This stress affects yield in processing the wafers into cells and modules. We report here on the application of a resonance acoustic method, used previously to measure stress in CZ silicon wafers, to characterize multicrystalline EFG silicon ribbon wafers.