带湿释放监测阵列的单片集成MEMS谐振器的研制

D. Zhao, Jun He, Xian Huang, Li Zhang, Fang Yang, Dacheng Zhang
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引用次数: 1

摘要

在这项工作中,制作了一个单片集成MEMS谐振器并进行了测试。采用表面微加工的方法,采用标准的3 μm CMOS工艺制作悬臂式MEMS谐振器。选择了稀释HF溶液的湿释放法,并与无水HF蒸汽释放法进行了比较。采用多晶硅/金悬臂阵列释放监测结构来测定牺牲材料的腐蚀时间。实验结果表明,采用该释放工艺后,mosfet的性能良好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of monolithic integrated MEMS resonator with wet-release-monitoring array
In this work, a monolithic integrated MEMS resonator was fabricated and tested. Surface micromachining method was employed to fabricate the cantilever MEMS resonator after a standard 3 μm CMOS process. The wet release method with dilute HF solution was chosen and compared to the anhydrous HF vapor release process. A release-monitoring structure with polysilicon/Au cantilever array was used to determine the corrosion time of the sacrificial material. Results showed that the MOSFETs function well after proposed release process.
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