基于GaN和SiGe的多功能芯片的全阵列-网格兼容宽带Tx/Rx Multipack

R. Rieger, A. Klaassen, P. Schuh, M. Oppermann
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引用次数: 0

摘要

用于多功能AESA系统的下一代射频传感器模块应在同一天线前端提供不同工作模式的组合,例如雷达、电子战和通信/数据链。覆盖c波段、x波段和ku波段的典型工作频率将需要> 10 GHz的带宽。至于现代有源电子控制天线(AESA)的实现,发射/接收(Tx/Rx)模块必须与几何约束相匹配,这些未来多功能射频传感器模块的主要挑战是由最高频率衍生的半波长网格需求,以及相应的光栅无瓣视场需求。克服这种几何形状需求的一个关键是通过将基于单芯片的射频功能“高级”集成到采用SiGe和gan技术实现的新型多功能MMIC中,从而减少MMIC芯片的总面积。通过实现Tx/Rx多封装而不是单通道Tx/Rx模块,可以进一步减小通道宽度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Full-Array-Grid-Compatible Wideband Tx/Rx Multipack using Multifunctional Chips on GaN and SiGe
A next generation of RF sensor modules for multifunction AESA systems shall provide a combination of different operating modes, e.g. Radar, EW and Communications/Datalink within the same antenna frontend. Typical operating frequencies covering C-Band, X-Band and Ku-Band will require a bandwidth of > 10 GHz, here. As for the realisation of modern active electronically steered antennas (AESA) the Transmit/Receive (Tx/Rx) Modules have to match with geometry constraints a major challenge for these future multifunction RF sensor modules is given by the half-wavelength grid demand derived from the highest frequency with accordant need for grating lobe free Field of View. One key to overcome this geometry demand can be the reduction of the total MMIC chip area with a "high-level" integration of single chip based RF functions into new multifunctional MMICs realised in SiGe- and GaN-technology. Further channel width reduction can be achieved by realising Tx/Rx multipacks instead of single-channel Tx/Rx Modules.
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