Thomas Sanders, John Bescup, S. Avasapian, Gil Garteiz, Ryan Ross
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Environmental X-Ray Computed Tomography (E-CT)—3D CT at Elevated to Cryogenic Temperatures
While 2.5D and 3D solutions continue to drive advancements in the electronics packaging industry, challenges persist with their reliability and qualification. In this paper, we introduce a new technique that may prove valuable for nondestructive, in-situ measurements of package and die warpage. This system allows for the powerful visualization tools of Computed Tomography to be applied to samples at elevated and cryogenic temperatures over a broad temperature range (+125C to -257C).
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