真空火花作为下一代光刻的EUV源的发展

Chew Soo Hoon, W. San
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摘要

极紫外光刻技术(EUVL)是下一代光刻技术(NGL)的一种新技术,该技术需要在约13.5 nm的2%波段内进行辐射。为了满足生产临界尺寸为50nm及以下的半导体芯片的需求,需要13.5 nm的EUV源。目前,基于等离子体的极紫外光源,如激光产生的等离子体和气体放电,被国际上许多人认为是实用的光源。最近,在真空火花放电方面取得了很大进展,因为它们似乎提供了一种具有更高转换效率到极紫外光光子的替代方案。真空火花(UMVS-III)是一种紧凑的脉冲等离子体放电,作为一种可能的极紫外光源,在本实验室进行了研究。将真空火花产生x射线的早期研究工作扩展到极紫外光区。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of the Vacuum Spark as an EUV Source for Next Generation Lithography
Extreme ultraviolet lithography (EUVL) which requires a radiation in a 2% wavelength band around 13.5 nm is expected to be the next generation lithography (NGL) system. A 13.5 nm EUV source is needed to satisfy the demand for the production of semiconductor chips with critical dimensions of 50 nm and below. Nowadays, plasma based EUV sources such as laser produced plasmas and gas discharges are considered internationally by many as the practical light sources. Recently, much progress has been made in vacuum spark discharges as they seem to offer an alternative with much higher conversion efficiency into EUV photons. The vacuum spark (UMVS-III) being a compact pulsed plasma discharge has been investigated in this laboratory as a possible EUV source. An extension of the earlier research work on X-ray production by the vacuum spark to the EUV region is carried out.
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