Development of electrostatic precipitator and wet scrubber integration technology for controlling NOx and particulate matter emission from semiconductor manufacturing process

This study was aimed to develop of electrostatic precipitator and wet scrubber integration technology for controlling NOx and particulate matter emission from semiconductor manufacturing process. The integration system was consisted of O3 oxidation, wet scrubber and electrostatic precipitators (EPSs). In O3 oxidation, NO gas was fully oxidized by O3 before flow gas was entered through wet scrubber. NO2 was mostly absorbed by wet scrubber using Na2S and NaOH without generating H2S. In ESPs, the negative voltage of 15 kV was applied to collection plate, and the particle removal efficiency showed higher than 95%. The practical removal efficiency was higher than theoretical because the practical loading by discharging corona was greater than the theoretical. In addition, the particle removal efficiency was maintained at 95% for 60 min through the water film.