高温超导体——电学方面的考虑及其在微电子领域的可能应用

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75940

R. Dumcke, G. Fotheringham, H. Reichl

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引用次数: 1

摘要

综述了VLSI集成趋势对片对片互连需求的影响。讨论了片内和片外互连系统在液氮温度下的传输。考虑了高T/sub / c超导体的材料特性，指出了由此引起的超导互连线传输在线特性的变化。讨论了可能的应用和一些有待解决的问题

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High temperature superconductors-electrical considerations and possible applications in microelectronics

The impact of VLSI integration trends on the requirements of chip-to-chip interconnects is reviewed. The propagation of on-chip and off-chip interconnection systems at liquid nitrogen temperatures are discussed for signal and power lines. Material properties of high T/sub c/-superconductors are considered and the resulting changes for transmission-line properties of superconducting interconnects are pointed out. Possible applications and some open problems are discussed.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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