{"title":"用于60ghz射频SiP中功率噪声抑制的带宽增强EBG结构","authors":"Chuen-De Wang, Tzong-Lin Wu","doi":"10.1109/ISEMC.2011.6038402","DOIUrl":null,"url":null,"abstract":"A novel electromagnetic bandgap (EBG) structure is proposed to mitigate power noise in the power distribution network of RF SiP. In order to enhance the bandwidth of the suppression stopband, the proposed EBG structure is implemented by employing multi-layer printed circuit board and multiple power/ground via pairs with narrow pitch. The design concepts for the enhancement of the lower/upper bound cutoff frequency are investigated in this paper. Test boards are fabricated and measured to validate the accuracy of the design concepts. The measured results show good consistency with simulated ones. To demonstrate the influence of the power noise on RF SiP, a simulation environment including a 60 GHz power amplifier and power distribution network on the package level is established. Besides, the proposed EBG power/ground plane is employed to suppress the power noise and intermodulation distortion of the RF output spectrum.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"107 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP\",\"authors\":\"Chuen-De Wang, Tzong-Lin Wu\",\"doi\":\"10.1109/ISEMC.2011.6038402\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel electromagnetic bandgap (EBG) structure is proposed to mitigate power noise in the power distribution network of RF SiP. In order to enhance the bandwidth of the suppression stopband, the proposed EBG structure is implemented by employing multi-layer printed circuit board and multiple power/ground via pairs with narrow pitch. The design concepts for the enhancement of the lower/upper bound cutoff frequency are investigated in this paper. Test boards are fabricated and measured to validate the accuracy of the design concepts. The measured results show good consistency with simulated ones. To demonstrate the influence of the power noise on RF SiP, a simulation environment including a 60 GHz power amplifier and power distribution network on the package level is established. Besides, the proposed EBG power/ground plane is employed to suppress the power noise and intermodulation distortion of the RF output spectrum.\",\"PeriodicalId\":440959,\"journal\":{\"name\":\"2011 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":\"107 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-10-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2011.6038402\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2011.6038402","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP
A novel electromagnetic bandgap (EBG) structure is proposed to mitigate power noise in the power distribution network of RF SiP. In order to enhance the bandwidth of the suppression stopband, the proposed EBG structure is implemented by employing multi-layer printed circuit board and multiple power/ground via pairs with narrow pitch. The design concepts for the enhancement of the lower/upper bound cutoff frequency are investigated in this paper. Test boards are fabricated and measured to validate the accuracy of the design concepts. The measured results show good consistency with simulated ones. To demonstrate the influence of the power noise on RF SiP, a simulation environment including a 60 GHz power amplifier and power distribution network on the package level is established. Besides, the proposed EBG power/ground plane is employed to suppress the power noise and intermodulation distortion of the RF output spectrum.
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