LSM视觉测量器R&R研究

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI:10.1109/IEMT.1995.526194

W. S. Messina, L.G. Willey, K. W. Jones

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引用次数: 1

摘要

本研究的目的是评估激光扫描显微镜(LSM)是否能够测量锡膏高度。LSM将扫描激光束投射到PC板上，该板在锡膏沉积周围偏转。膏体的高度分别由膏体表面和周围的最高(上)和最低(下)激光偏转点的差来确定。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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LSM vision gage R&R study

The purpose of this study is to assess whether the laser scanning microscope (LSM) is capable of measuring solder paste height. The LSM projects a scanning laser beam onto the PC board which is deflected around the solder paste deposit. The height of the paste was determined by taking the difference between the highest (top) and lowest (bottom) laser deflection points on and surrounding the paste deposit respectively.

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来源期刊

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

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