ICCAD-2014先进半导体节点和基准套件可制造性流程设计CAD竞赛

2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) Pub Date : 2014-11-03 DOI:10.1109/ICCAD.2014.7001377

R. Topaloglu

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引用次数: 16

摘要

我们介绍了填充优化问题和基准测试。我们提供了两个新的热点定义，槽线偏差和异常值，它们都与产量有关。我们提供了问题的输入、预期输出以及目标和约束条件。

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ICCAD-2014 CAD contest in design for manufacturability flow for advanced semiconductor nodes and benchmark suite

We introduce the fill optimization problem and benchmarks. We provide two new hotspot definitions, slot line deviation and outliers, both of which pertain to yield. We provide the inputs, expected output, as well as objectives and constraints of the problem.

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来源期刊

2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

自引率

0.00%

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