Preparation of Uniform SiO2 Insulating Layer on the Inner Wall of TSV by Thermal Oxidation

SiO2 insulating layer is an indispensable part of a TSV. In the current process, the SiO2 insulating layer is commonly deposited on the inner wall of the TSV based on deep trench sputtering method. The thickness at different position (neck, middle, bottom) of the SiO2 insulating layer, deposited by deep trench sputtering, is non-uniform. In this paper, the thickness uniformity of SiO2 insulating layer prepared on the inner wall of TSV based on CVD&PVD process and thermal oxidation method is comparatively studied. The experimental results show that, based on the CVD&PVD process, the average thickness of the SiO2 insulating layer at middle and bottom position of the TSV has changed by - 54.02% and - 58.30% compared with that at the top position, respectively. Based on the thermal oxidation method, the average thickness of the SiO2 insulating layer at middle and bottom position of the TSV has changed by 1.17% and 0.26% compared with that at the top position, respectively. The thermal oxidation method can realize the SiO2 insulating layer with uniform thickness on the inner wall of TSV.