模具黏合剂的建模过程

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI:10.1109/ISAPM.1998.664455

J. Taweeplengsangsuke, J. Hsiung, R. Pearson

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引用次数: 9

摘要

采用多步固化的方法来降低聚合物胶粘剂的残余固化应力。两步固化的低温段时间越长，固化应力越小。此外，还对冷却过程中的应力进行了研究。当温度降低时，应力急剧增大。温差越大，残余应力越大。

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Modeling the die attach adhesives process

Multi-step curing was performed to reduce the residual cure stress in the polymeric adhesives. The longer the period of time at the lower temperature step of the 2-step curing gave the lower cure stress. In addition, the stress during the cool down process was investigated. At the point of decreasing temperature, the stress dramatically increases. The higher temperature difference, the larger the residual stress.

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来源期刊

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)

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