独立式大功率氮化镓多鳍驼峰二极管变容管

Po‐Chun Chen, P. Asbeck, S. Dayeh
{"title":"独立式大功率氮化镓多鳍驼峰二极管变容管","authors":"Po‐Chun Chen, P. Asbeck, S. Dayeh","doi":"10.1109/DRC55272.2022.9855653","DOIUrl":null,"url":null,"abstract":"To achieve wideband tunable filters that can handle high power in RF front end modules, high voltage varactors with a high quality factor, Q, are required. Among candidate semiconductor materials for high breakdown voltages exceeding 100V, gallium nitride (GaN) varactors can theoretically reach the highest figure of merit, Qmin, owing to outstanding breakdown field and good electron mobility1. However, high reverse bias leakage currents lower the breakdown voltage and restrict Q of conventional vertical GaN -based Schottky diodes due to (i) limited barrier heights attained on GaN, and (ii) leakage through threading dislocations. Furthermore, generally high contact resistance of p-type GaN Ohmic contact limits Q of vertical GaN pn junction diodes2, Here, we report devices that overcome these limitations by combining novel material and device architectures. First, we employ a camel diode structure composed of a thin and fully depleted p+ GaN top layer situated between the Schottky metal and an n-type GaN drift layer3. This raises the barrier height to suppress electron tunneling when compared to Schottky diodes (Fig. 1 a) and reduces the overlap of states for band-to-band tunneling in pn diodes. Second, we utilize GaN on a QST (Qromis Substrate Technology) wafer that permits the growth of thick GaN layers with lower dislocation densities and lower leakage than GaN-on-Si4. We report in this work the DC and s-parameter characterization results and discuss the potential of this varactor technology.","PeriodicalId":200504,"journal":{"name":"2022 Device Research Conference (DRC)","volume":"182 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Free-Standing High Power GaN Multi-Fin Camel Diode Varactors\",\"authors\":\"Po‐Chun Chen, P. Asbeck, S. Dayeh\",\"doi\":\"10.1109/DRC55272.2022.9855653\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To achieve wideband tunable filters that can handle high power in RF front end modules, high voltage varactors with a high quality factor, Q, are required. Among candidate semiconductor materials for high breakdown voltages exceeding 100V, gallium nitride (GaN) varactors can theoretically reach the highest figure of merit, Qmin, owing to outstanding breakdown field and good electron mobility1. However, high reverse bias leakage currents lower the breakdown voltage and restrict Q of conventional vertical GaN -based Schottky diodes due to (i) limited barrier heights attained on GaN, and (ii) leakage through threading dislocations. Furthermore, generally high contact resistance of p-type GaN Ohmic contact limits Q of vertical GaN pn junction diodes2, Here, we report devices that overcome these limitations by combining novel material and device architectures. First, we employ a camel diode structure composed of a thin and fully depleted p+ GaN top layer situated between the Schottky metal and an n-type GaN drift layer3. This raises the barrier height to suppress electron tunneling when compared to Schottky diodes (Fig. 1 a) and reduces the overlap of states for band-to-band tunneling in pn diodes. Second, we utilize GaN on a QST (Qromis Substrate Technology) wafer that permits the growth of thick GaN layers with lower dislocation densities and lower leakage than GaN-on-Si4. We report in this work the DC and s-parameter characterization results and discuss the potential of this varactor technology.\",\"PeriodicalId\":200504,\"journal\":{\"name\":\"2022 Device Research Conference (DRC)\",\"volume\":\"182 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-06-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 Device Research Conference (DRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DRC55272.2022.9855653\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 Device Research Conference (DRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC55272.2022.9855653","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

为了实现可以处理RF前端模块中高功率的宽带可调谐滤波器,需要具有高质量因数Q的高压变容器。在超过100V的高击穿电压候选半导体材料中,氮化镓(GaN)变容体由于其出色的击穿场和良好的电子迁移率,理论上可以达到最高的品质值Qmin 1。然而,高反向偏置泄漏电流会降低击穿电压并限制传统垂直GaN基肖特基二极管的Q,这是由于(i) GaN上获得的势垒高度有限,以及(ii)螺纹位错导致的泄漏。此外,通常p型GaN的高接触电阻欧姆接触限制了垂直GaN pn结二极管的Q。在这里,我们报告了通过结合新材料和器件架构来克服这些限制的器件。首先,我们采用驼峰二极管结构,由位于肖特基金属和n型GaN漂移层之间的薄且完全耗尽的p+ GaN顶层组成。与肖特基二极管相比,这提高了势垒高度以抑制电子隧穿(图1a),并减少了pn二极管中带对带隧穿的状态重叠。其次,我们在QST (Qromis衬底技术)晶圆上使用GaN,允许生长具有较低位错密度和较低泄漏的GaN层。我们报告了直流和s参数的表征结果,并讨论了该变容管技术的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Free-Standing High Power GaN Multi-Fin Camel Diode Varactors
To achieve wideband tunable filters that can handle high power in RF front end modules, high voltage varactors with a high quality factor, Q, are required. Among candidate semiconductor materials for high breakdown voltages exceeding 100V, gallium nitride (GaN) varactors can theoretically reach the highest figure of merit, Qmin, owing to outstanding breakdown field and good electron mobility1. However, high reverse bias leakage currents lower the breakdown voltage and restrict Q of conventional vertical GaN -based Schottky diodes due to (i) limited barrier heights attained on GaN, and (ii) leakage through threading dislocations. Furthermore, generally high contact resistance of p-type GaN Ohmic contact limits Q of vertical GaN pn junction diodes2, Here, we report devices that overcome these limitations by combining novel material and device architectures. First, we employ a camel diode structure composed of a thin and fully depleted p+ GaN top layer situated between the Schottky metal and an n-type GaN drift layer3. This raises the barrier height to suppress electron tunneling when compared to Schottky diodes (Fig. 1 a) and reduces the overlap of states for band-to-band tunneling in pn diodes. Second, we utilize GaN on a QST (Qromis Substrate Technology) wafer that permits the growth of thick GaN layers with lower dislocation densities and lower leakage than GaN-on-Si4. We report in this work the DC and s-parameter characterization results and discuss the potential of this varactor technology.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信