用于I/sub DDQ/测试的内置电流传感器(BICS)的局限性

S. Menon, Y. Malaiya, A. Jayasumana, C. Tong
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引用次数: 5

摘要

静态CMOS器件产生的静态电流(I/sub DDQ/)非常小,约为纳米安培数量级。在许多故障情况下,(I/sub DDQ/)可以增加几个数量级。外部或片内电流传感器都可以用来检测静态CMOS器件所产生的增强静态电流。片上传感器,称为BICS(内置电流传感器)可以显着更快。近年来,BICS的实施受到了很多关注。考虑了BICS对I/sub DDQ测量的一些限制,这些限制是由于I/sub DDQ的建立时间和传播延迟的增加而引起的。结果表明,为了实现BICS,需要特别注意电路划分。提出了在设计新型BICS时需要考虑的一些因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Limitations of built-in current sensors (BICS) for I/sub DDQ/ testing
Quiescent current (I/sub DDQ/) drawn by a static CMOS device is extremely small and is of the order of nanoamperes. Under many faults, (I/sub DDQ/) can increase by several orders of magnitude. Either an external or an on-chip current sensor can be used to detect enhanced static current drawn by a static CMOS device. An on-chip sensor, termed a BICS (Built-In Current Sensor) can be significantly faster. Implementation of BICS has received a lot of interest in the recent years. Some limitations posed by BICS on I/sub DDQ/ measurement caused due to increase in I/sub DDQ/ settling time as well as propagation delay is considered. Results indicate that careful attention needs to be given to circuit partitioning for implementing BICS. Some of the considerations that need to be taken into account while designing new BICS are presented.<>
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