G. Pecanac, C. Silber, K. Kosbi, L. Vollmer, M. Wiedenmann, T. von Bargen, A. Fischer
{"title":"分析ASIC封装中的分层","authors":"G. Pecanac, C. Silber, K. Kosbi, L. Vollmer, M. Wiedenmann, T. von Bargen, A. Fischer","doi":"10.1109/EUROSIME.2017.7926219","DOIUrl":null,"url":null,"abstract":"The reliability of microelectronic devices is often limited by internal local delamination that occurs between the polyimide layer and the re-distribution top metal layer on the chip surface during temperature cycle testing. In order to design reliable microelectronic packages and to avoid additional delay and cost of potential re-designs, such effects should be thoroughly analyzed, understood and avoided already in the design phase of the product.","PeriodicalId":174615,"journal":{"name":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Analyzing delamination in ASIC packages\",\"authors\":\"G. Pecanac, C. Silber, K. Kosbi, L. Vollmer, M. Wiedenmann, T. von Bargen, A. Fischer\",\"doi\":\"10.1109/EUROSIME.2017.7926219\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The reliability of microelectronic devices is often limited by internal local delamination that occurs between the polyimide layer and the re-distribution top metal layer on the chip surface during temperature cycle testing. In order to design reliable microelectronic packages and to avoid additional delay and cost of potential re-designs, such effects should be thoroughly analyzed, understood and avoided already in the design phase of the product.\",\"PeriodicalId\":174615,\"journal\":{\"name\":\"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2017.7926219\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2017.7926219","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The reliability of microelectronic devices is often limited by internal local delamination that occurs between the polyimide layer and the re-distribution top metal layer on the chip surface during temperature cycle testing. In order to design reliable microelectronic packages and to avoid additional delay and cost of potential re-designs, such effects should be thoroughly analyzed, understood and avoided already in the design phase of the product.
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