采用新型湿式清洁工具，在45nm节点以上进行精细边缘和斜角膜剥离工艺

2007 International Symposium on Semiconductor Manufacturing Pub Date : 2007-10-01 DOI:10.1109/ISSM.2007.4446885

Y. Ogawa, H. Nagashima, Y. Yoshimizu, H. Tomita, T. Kishimoto, K. Miya, A. Izumi

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引用次数: 2

摘要

在本文中，我们指出了使用传统的斜面和背面刻蚀工具在边缘切割区域进行高k薄膜剥离的困难，并提出了一种使用新型斜面和背面刻蚀工具的精细边缘切割控制工艺。

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Fine edge and bevel film stripping process by novel wet cleaning tool beyond 45nm node

In this paper, we indicate the difficulty of high-k film stripping of edge cut area using conventional bevel and backside etching tool and propose a fine edge cut control process using a novel bevel and backside etching tool with edge dispense nozzles.

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来源期刊

2007 International Symposium on Semiconductor Manufacturing

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