K. Shinohara, D. Regan, A. Corrion, D. Brown, I. Alvarado-Rodoriguez, M. Cunningham, C. Butler, A. Schmitz, S. Kim, B. Holden, D. Chang, V. Lee, P. Asbeck
{"title":"用于亚毫米波放大器和混合信号应用的深度缩放E/ d模式gan - hemt","authors":"K. Shinohara, D. Regan, A. Corrion, D. Brown, I. Alvarado-Rodoriguez, M. Cunningham, C. Butler, A. Schmitz, S. Kim, B. Holden, D. Chang, V. Lee, P. Asbeck","doi":"10.1109/CSICS.2012.6340075","DOIUrl":null,"url":null,"abstract":"In this paper, we report state-of-the-art high-frequency performance of GaN-based HEMTs achieved through innovative device scaling technologies such as vertically-scaled AlN/GaN/AlGaN double-heterojunction (DH) HEMT epitaxial structure, low-resistance n+-GaN ohmic contacts regrown by MBE, and manufacturable 20-nm self-aligned sidewall gate process. Engineering top barrier layer structure enabled both enhancement- and depletion-mode (E/D) device operations with record cutoff frequencies while maintaining Johnson figure of merit (JFoM) breakdown performance. Furthermore, E/D-mode devices were monolithically integrated using a full epitaxial regrowth technique with a successful demonstration of DCFL ring oscillator circuits. Deeply-scaled E/D-mode GaN-HEMTs with an unprecedented combination of high-frequency and high-breakdown characteristics offer practical advantages in circuit applications such as sub-millimeter-wave power amplifiers, ultra-linear mixers, and increased output power digital-to-analog converters.","PeriodicalId":290079,"journal":{"name":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Deeply-Scaled E/D-Mode GaN-HEMTs for Sub-mm-Wave Amplifiers and Mixed-Signal Applications\",\"authors\":\"K. Shinohara, D. Regan, A. Corrion, D. Brown, I. Alvarado-Rodoriguez, M. Cunningham, C. Butler, A. Schmitz, S. Kim, B. Holden, D. Chang, V. Lee, P. Asbeck\",\"doi\":\"10.1109/CSICS.2012.6340075\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we report state-of-the-art high-frequency performance of GaN-based HEMTs achieved through innovative device scaling technologies such as vertically-scaled AlN/GaN/AlGaN double-heterojunction (DH) HEMT epitaxial structure, low-resistance n+-GaN ohmic contacts regrown by MBE, and manufacturable 20-nm self-aligned sidewall gate process. Engineering top barrier layer structure enabled both enhancement- and depletion-mode (E/D) device operations with record cutoff frequencies while maintaining Johnson figure of merit (JFoM) breakdown performance. Furthermore, E/D-mode devices were monolithically integrated using a full epitaxial regrowth technique with a successful demonstration of DCFL ring oscillator circuits. Deeply-scaled E/D-mode GaN-HEMTs with an unprecedented combination of high-frequency and high-breakdown characteristics offer practical advantages in circuit applications such as sub-millimeter-wave power amplifiers, ultra-linear mixers, and increased output power digital-to-analog converters.\",\"PeriodicalId\":290079,\"journal\":{\"name\":\"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2012.6340075\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2012.6340075","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Deeply-Scaled E/D-Mode GaN-HEMTs for Sub-mm-Wave Amplifiers and Mixed-Signal Applications
In this paper, we report state-of-the-art high-frequency performance of GaN-based HEMTs achieved through innovative device scaling technologies such as vertically-scaled AlN/GaN/AlGaN double-heterojunction (DH) HEMT epitaxial structure, low-resistance n+-GaN ohmic contacts regrown by MBE, and manufacturable 20-nm self-aligned sidewall gate process. Engineering top barrier layer structure enabled both enhancement- and depletion-mode (E/D) device operations with record cutoff frequencies while maintaining Johnson figure of merit (JFoM) breakdown performance. Furthermore, E/D-mode devices were monolithically integrated using a full epitaxial regrowth technique with a successful demonstration of DCFL ring oscillator circuits. Deeply-scaled E/D-mode GaN-HEMTs with an unprecedented combination of high-frequency and high-breakdown characteristics offer practical advantages in circuit applications such as sub-millimeter-wave power amplifiers, ultra-linear mixers, and increased output power digital-to-analog converters.