{"title":"PCB层压材料面外介电常数提取方法","authors":"Huiyin Zhou, Wei Zhang","doi":"10.1109/SPI54345.2022.9874947","DOIUrl":null,"url":null,"abstract":"PCB laminate material with dense glass style has a layered structure of resin-fiberglass-resin. Out-of-plane dielectric constant (Dk) is required to achieve accurate transmission line modeling, but laminate manufacturers usually only provide in-plane Dk. This paper introduces a 3D electromagnetic analysis based methodology to extract out-of-plane Dk out from in-plane Dk specification. The correctness of the extracted out-of-plane Dk is confirmed by TDR correlation between measurement and simulation.","PeriodicalId":285253,"journal":{"name":"2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)","volume":"23 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"PCB Laminate Material Out-of-plane Dielectric Constant Extraction Methodology\",\"authors\":\"Huiyin Zhou, Wei Zhang\",\"doi\":\"10.1109/SPI54345.2022.9874947\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"PCB laminate material with dense glass style has a layered structure of resin-fiberglass-resin. Out-of-plane dielectric constant (Dk) is required to achieve accurate transmission line modeling, but laminate manufacturers usually only provide in-plane Dk. This paper introduces a 3D electromagnetic analysis based methodology to extract out-of-plane Dk out from in-plane Dk specification. The correctness of the extracted out-of-plane Dk is confirmed by TDR correlation between measurement and simulation.\",\"PeriodicalId\":285253,\"journal\":{\"name\":\"2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"23 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI54345.2022.9874947\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 26th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI54345.2022.9874947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
PCB Laminate Material Out-of-plane Dielectric Constant Extraction Methodology
PCB laminate material with dense glass style has a layered structure of resin-fiberglass-resin. Out-of-plane dielectric constant (Dk) is required to achieve accurate transmission line modeling, but laminate manufacturers usually only provide in-plane Dk. This paper introduces a 3D electromagnetic analysis based methodology to extract out-of-plane Dk out from in-plane Dk specification. The correctness of the extracted out-of-plane Dk is confirmed by TDR correlation between measurement and simulation.
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