Si和GaAs材料对低功耗三维密度梯度纳米线MOSFET设计影响的分析比较

Syeda Fahima Nazreen, M. Ali
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引用次数: 0

摘要

半导体行业一直是最具发展前景的行业之一,而MOSFET是其主要组成部分。自从它开始在市场上提供更好的性能和低成本的有效设备以来,广泛的研究正在进行。该研究是在3D密度梯度纳米线MOSFET上完成的,以显示使用不同材料对器件性能的影响。对硅(Si)和砷化镓(GaAs)作为半导体材料进行了比较。对两种模型进行了直流和交流分析,并对结果进行了比较。使用的GaAs模型的Id-Vg和Id-Vd曲线中的漏极电流比使用的Si模型高约10倍,这对于模拟应用是有用的。两种型号的阈值电压均为0.7V。此外,与以Si为材料的模型相比,使用GaAs材料的模型的电子浓度形成深度约为104的势阱。在交流分析的情况下,使用GaAs的模型的跨导范围几乎是使用Si设计的模型的两倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analytical Comparison of the Impact of Si and GaAs as Materials in Designing 3D Density Gradient Nanowire MOSFET for Low Power Applications
Semiconductor industry has been one of the most promising industries and MOSFET is its main component. Extensive research is going on ever since it started to provide better performance and low-cost effective devices in the market. The study is done on a 3D density gradient nanowire MOSFET for showing the impact of using varied materials on the device performance. A comparison has been made between Silicon (Si) and Gallium Arsenide (GaAs) as semiconductor materials. DC and AC analysis have been done on both models and their results have been compared. The drain current in the Id-Vg and Id-Vd curve for GaAs used model is higher than the Si used model by about 10 times which is useful for analog applications. The threshold voltage for both models is 0.7V. Besides that, the electron concentration forming a potential well of the depth of about 104 for GaAs used material than the model made using Si as material. In the case of AC analysis, the transconductance range for the model using GaAs is almost double of the model designed using Si.
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