{"title":"提高先进集成电路制造成品率的统计方法","authors":"A. C. Carlson, S.L. Sundaran","doi":"10.1109/ASMC.1991.167376","DOIUrl":null,"url":null,"abstract":"The methods of planned experimentation, statistical error propagation, multi-vari and Pareto are discussed in terms of scaled-high-voltage analog BiMOS technology and advanced analog IC manufacturing. Applications of statistical techniques using response surface methodology, planned experimentation, statistical-error propagation, multi-vari and Pareto analysis are shown to enhance the definition, optimization, and resolution of complex processing and device problems. The multidisciplinary approach, which involves statistics, device physics, process characterization, device characterization, and manufacturing, plays a major role in the introduction of new IC technology and yield improvements in IC products. The case studies presented demonstrate the essential need for a statistical approach to solve complex IC manufacturing problems.<<ETX>>","PeriodicalId":177186,"journal":{"name":"[1991 Proceedings] IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"6 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Statistical approach for improving manufacturing yield in advanced IC fabrication\",\"authors\":\"A. C. Carlson, S.L. Sundaran\",\"doi\":\"10.1109/ASMC.1991.167376\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The methods of planned experimentation, statistical error propagation, multi-vari and Pareto are discussed in terms of scaled-high-voltage analog BiMOS technology and advanced analog IC manufacturing. Applications of statistical techniques using response surface methodology, planned experimentation, statistical-error propagation, multi-vari and Pareto analysis are shown to enhance the definition, optimization, and resolution of complex processing and device problems. The multidisciplinary approach, which involves statistics, device physics, process characterization, device characterization, and manufacturing, plays a major role in the introduction of new IC technology and yield improvements in IC products. The case studies presented demonstrate the essential need for a statistical approach to solve complex IC manufacturing problems.<<ETX>>\",\"PeriodicalId\":177186,\"journal\":{\"name\":\"[1991 Proceedings] IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"volume\":\"6 3\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991 Proceedings] IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1991.167376\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991 Proceedings] IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1991.167376","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Statistical approach for improving manufacturing yield in advanced IC fabrication
The methods of planned experimentation, statistical error propagation, multi-vari and Pareto are discussed in terms of scaled-high-voltage analog BiMOS technology and advanced analog IC manufacturing. Applications of statistical techniques using response surface methodology, planned experimentation, statistical-error propagation, multi-vari and Pareto analysis are shown to enhance the definition, optimization, and resolution of complex processing and device problems. The multidisciplinary approach, which involves statistics, device physics, process characterization, device characterization, and manufacturing, plays a major role in the introduction of new IC technology and yield improvements in IC products. The case studies presented demonstrate the essential need for a statistical approach to solve complex IC manufacturing problems.<>