B. Ottinger, Joshua Holverscheid, Sebastian König, Edgar Jerichow, Sebastian Lunz, M. Sprenger, Lars Müller, C. Goth, J. Franke
{"title":"汽车电源模块模具附件无铅焊料的可靠性","authors":"B. Ottinger, Joshua Holverscheid, Sebastian König, Edgar Jerichow, Sebastian Lunz, M. Sprenger, Lars Müller, C. Goth, J. Franke","doi":"10.1109/EPTC56328.2022.10013246","DOIUrl":null,"url":null,"abstract":"Four Sn- based solder joint materials SAC305, SnSb5, SnSb10 and PFDS400® were compared conducting active power cycling tests. In addition, the microstructure before and after the power cycling test was analyzed. Intermetallic compounds were detected at all tested solders after the soldering process. The composition and the amount of intermetallic compound (IMC) phases differed between the solders. The PFDS400® solder joint which consisted mostly of Cu6Sn5 intermetallic compound and an intermediate copper layer showed the highest lifetime followed by SnSb5, SnSb10 and SAC305 solder. While SAC305, SnSb5 and SnSb10 failed due to material fatigue, the PFDS400® solder joint did not show any cracks, damage, or delamination.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"9 9","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reliability of lead-free solders for die attach in automotive power modules\",\"authors\":\"B. Ottinger, Joshua Holverscheid, Sebastian König, Edgar Jerichow, Sebastian Lunz, M. Sprenger, Lars Müller, C. Goth, J. Franke\",\"doi\":\"10.1109/EPTC56328.2022.10013246\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Four Sn- based solder joint materials SAC305, SnSb5, SnSb10 and PFDS400® were compared conducting active power cycling tests. In addition, the microstructure before and after the power cycling test was analyzed. Intermetallic compounds were detected at all tested solders after the soldering process. The composition and the amount of intermetallic compound (IMC) phases differed between the solders. The PFDS400® solder joint which consisted mostly of Cu6Sn5 intermetallic compound and an intermediate copper layer showed the highest lifetime followed by SnSb5, SnSb10 and SAC305 solder. While SAC305, SnSb5 and SnSb10 failed due to material fatigue, the PFDS400® solder joint did not show any cracks, damage, or delamination.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"9 9\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013246\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013246","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability of lead-free solders for die attach in automotive power modules
Four Sn- based solder joint materials SAC305, SnSb5, SnSb10 and PFDS400® were compared conducting active power cycling tests. In addition, the microstructure before and after the power cycling test was analyzed. Intermetallic compounds were detected at all tested solders after the soldering process. The composition and the amount of intermetallic compound (IMC) phases differed between the solders. The PFDS400® solder joint which consisted mostly of Cu6Sn5 intermetallic compound and an intermediate copper layer showed the highest lifetime followed by SnSb5, SnSb10 and SAC305 solder. While SAC305, SnSb5 and SnSb10 failed due to material fatigue, the PFDS400® solder joint did not show any cracks, damage, or delamination.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
