{"title":"晶圆级可靠性(WLR)特别兴趣小组(SIG)","authors":"A. Martin","doi":"10.1109/IRWS.1999.830586","DOIUrl":null,"url":null,"abstract":"This year B vcry enthusiastic group of fificen people met to discuss WLKrncasurement methods, In a first step the WLR issues o f interest wcre collccted from the participants and the following list was compiled: Methods ofmonitoring. -How many companies use WLR? Evaluation/analysis of inensureincnt results. Correlation of long & short tcrm W l,R measurement results. Differences bctween parametric testing and WLR testing. ~ Important WI,R strcssmelhods: + EM, isothcimal test, CN; $. 'I'DDB, SII,C, thin oxides; +mobile ions; + non-volatile memorics; -II-IC; + low temperature testing; +plasma induccd damago. -Docs W1.R monitoring work? -What is the ob.jectivc/puipose of WLR monitoring; + qualification, -ttransfw, f development? Failurc criteria, scrap limits for WLK? I Who wants WLR monitoring? Can be ;a minimum time limit defined for WLR tests to get Activation of corrcct failure mechanisms. W1,R monitoring: a relative meaSurc or lifetime extrapolation? -Correlation between changes in the process & WLR monitoring rncmingful rcsults?","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"31 9","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wafer level reliability (WLR) special interest group (SIG)\",\"authors\":\"A. Martin\",\"doi\":\"10.1109/IRWS.1999.830586\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This year B vcry enthusiastic group of fificen people met to discuss WLKrncasurement methods, In a first step the WLR issues o f interest wcre collccted from the participants and the following list was compiled: Methods ofmonitoring. -How many companies use WLR? Evaluation/analysis of inensureincnt results. Correlation of long & short tcrm W l,R measurement results. Differences bctween parametric testing and WLR testing. ~ Important WI,R strcssmelhods: + EM, isothcimal test, CN; $. 'I'DDB, SII,C, thin oxides; +mobile ions; + non-volatile memorics; -II-IC; + low temperature testing; +plasma induccd damago. -Docs W1.R monitoring work? -What is the ob.jectivc/puipose of WLR monitoring; + qualification, -ttransfw, f development? Failurc criteria, scrap limits for WLK? I Who wants WLR monitoring? Can be ;a minimum time limit defined for WLR tests to get Activation of corrcct failure mechanisms. W1,R monitoring: a relative meaSurc or lifetime extrapolation? -Correlation between changes in the process & WLR monitoring rncmingful rcsults?\",\"PeriodicalId\":131342,\"journal\":{\"name\":\"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)\",\"volume\":\"31 9\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.1999.830586\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1999.830586","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wafer level reliability (WLR) special interest group (SIG)
This year B vcry enthusiastic group of fificen people met to discuss WLKrncasurement methods, In a first step the WLR issues o f interest wcre collccted from the participants and the following list was compiled: Methods ofmonitoring. -How many companies use WLR? Evaluation/analysis of inensureincnt results. Correlation of long & short tcrm W l,R measurement results. Differences bctween parametric testing and WLR testing. ~ Important WI,R strcssmelhods: + EM, isothcimal test, CN; $. 'I'DDB, SII,C, thin oxides; +mobile ions; + non-volatile memorics; -II-IC; + low temperature testing; +plasma induccd damago. -Docs W1.R monitoring work? -What is the ob.jectivc/puipose of WLR monitoring; + qualification, -ttransfw, f development? Failurc criteria, scrap limits for WLK? I Who wants WLR monitoring? Can be ;a minimum time limit defined for WLR tests to get Activation of corrcct failure mechanisms. W1,R monitoring: a relative meaSurc or lifetime extrapolation? -Correlation between changes in the process & WLR monitoring rncmingful rcsults?
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