基于有限元仿真的虚拟装配过程LED设计优化

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529906

S. Watzke, P. Altieri-Weimar

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引用次数: 0

摘要

本文研究了发光二极管(LED)产品的装配工艺步骤对其可靠性行为的影响。在有限元模型中开发了虚拟装配过程，并利用材料表征的实验结果和LED产品的鲁棒性结果进行了验证。重点放在分层失效和失效风险与装配过程变化之间的关系。额外的环境条件，如温度和湿度浓度考虑在装配过程中。有限元模型揭示了虚拟装配产品的可靠性与环境条件之间的关系，并提供了优化LED设计的能力，以确保产品的鲁棒性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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LED design optimization by means of virtual assembly process based on FEM simulation

In this study the influence of assembly process steps on reliability behavior of Light Emitting Diodes (LED) products is investigated. A virtual assembly process is developed in Finite Element (FE) model and is validated using experimental results deriving from material characterization as well as robustness results of the LED products. Focus is set on delamination failures and the correlation between failure risk and variations of the assembly process. Additional environmental conditions such as temperature and moisture concentration are taken into account during the assembly process. The FE model gives insights into the relationship between the reliability of the virtual assembled product and the environmental conditions and offers the capability of LED design optimization to ensure the robustness of the products.

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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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