FinFET:从紧凑的建模到电路性能

F. He, Xingye Zhou, Chenyue Ma, Jian Zhang, Zhiwei Liu, Wen Wu, Xukai Zhang, Lining Zhang
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引用次数: 12

摘要

FinFET器件是将CMOS扩展到10nm及以上的候选器件之一,近年来引起了广泛的研究兴趣。在将工艺技术与电路设计方法并行化的过程中,迫切需要一种紧凑的模型作为工艺技术与电路设计之间的纽带。在本文中,我们首先回顾了FinFET的工艺技术,包括SOI-FinFET和块状FinFET。然后提出了一个基于电势的紧凑模型来描述FinFET晶体管的电特性。通过二维数值仿真验证了该模型的正确性,并在HSPICE模拟器中实现。最后,对FinFET器件的可靠性问题和电路功能进行了说明和分析,这对实际应用和电路设计具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FinFET: From compact modeling to circuit performance
FinFET device, the promise one of all candidates which may extend CMOS scaling to 10nm and beyond, has attracted intensive research interest in recent years. In paralleling the process technology and circuit design methodology, a compact model which serves as a link between the process technology and circuit design is strongly demanded. In this paper, we first review the FinFET process technology including SOI-FinFET and bulk-FinFET. Then a potential-based compact model is proposed to describe the electrical characteristics of the FinFET transistor. The model is verified by 2-D numerical simulation and is implemented into HSPICE simulator. Finally, the reliability issue of the FinFET device and circuit functions are illustrated and analyzed, which are important for the practical applications and circuit design.
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