基于0.13 μm SiGe BiCMOS技术的56 Gb/s PAM-4线性透阻放大器

S. Bhagavatheeswaran, T. Cummings, Eric Tangen, M. Heins, R. Chan, C. Steinbeiser
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引用次数: 8

摘要

本文介绍了用于数据中心互连(DCI)和基站前端传输应用的PAM-4/NRZ/DMT调制格式的先进56Gb/s单通道线性跨阻放大器(TIA)集成电路的实现。TIA采用130nm SiGe BiCMOS工艺制造,具有单端差分输出配置,标称最大直流跨阻增益为~ 5.8 kQ (75 dB),增益动态范围为28 dB,平均输入参考噪声(IRN)为14.9 pA/VHz,整个增益动态范围的典型带宽为38 GHz,输出500mVppd时总谐波失真(THD)为2%,输出电压摆幅可调至1Vppd,所有工作在3.3 V的典型电源下。在2.8 V电源下,实现了34 GHz的带宽。性能测量范围从- 5C到95C。该TIA具有用于测量输入信号强度的接收信号强度指示器(RSSI),用于测量输出幅度的峰值检测(PKD)功能和内置光电二极管(PD)阴极偏置网络。该芯片可以在手动增益控制(MGC)或自动增益控制(AGC)模式下工作。模具面积1.6 mmA2。一个最先进的4级脉冲幅度调制(PAM-4)眼图在56Gb/s已经证明了这种线性TIA。该芯片已集成到Discovery半导体的光学产品和几个光学互连产品中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 56 Gb/s PAM-4 linear transimpedance amplifier in 0.13-μm SiGe BiCMOS technology for optical receivers
This paper describes the implementation of a state-of-the art 56Gb/s single-channel linear transimpedance amplifier (TIA) integrated circuit for PAM-4/NRZ/DMT modulation formats used in data center interconnects (DCI) and base station front haul applications. Fabricated in 130nm SiGe BiCMOS process, the TIA has a single-ended input, differential output configuration, with nominal maximum DC transimpedance gain of ∼5.8 kQ (75 dB), gain dynamic range of 28 dB, average input referred noise (IRN) of 14.9 pA/VHz, typical bandwidth of 38 GHz across the entire gain dynamic range, Total Harmonic Distortion (THD) of 2% for output of 500mVppd, adjustable output voltage swing up to 1Vppd, all operated with typical supply of 3.3 V. At 2.8 V supply, bandwidth of 34 GHz has been achieved. Performance has been measured from −5C to 95C. The TIA has Receive Signal Strength Indicator (RSSI) for measuring the input signal strength, peak detect (PKD) function for measuring the output amplitude and in-built photo-diode (PD) cathode bias network. The chip can be operated in manual gain control (MGC) or automatic gain control (AGC) mode. The die area is 1.6 mmA2. A state-of-the art 4-level Pulse Amplitude Modulation (PAM-4) eye diagram at 56Gb/s has been demonstrated with this linear TIA. The Die has been integrated into an optical product from Discovery Semiconductors and several optical interconnect products.
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