毫米波封装设计:仿真与测量结果的比较

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967604

L. Shan, M. Meghelli, Joong-Ho Kim, J. Trewhella, M. Taubenblatt, M. Oprysko

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引用次数: 8

摘要

本文介绍了一种40gb /s的封装设计。该封装包括高速同轴连接器、陶瓷基板上的传输线和带状键。为了在现有计算能力下保持模型结构，将仿真分为同轴连接器到传输线、传输线单独、传输线到带状键合三个部分，然后将仿真结果进行汇总，预测封装的性能。进行了小信号测量和操作测试，以验证设计和建模概念。该封装的运行速度高达50 Gb/s，对输入数字波形的退化很低。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Millimeter wave package design: a comparison of simulation and measurement results

A 40 Gb/s package design is introduced in this work. The package includes high-speed coaxial connectors, transmission lines on ceramic substrate, and ribbon bonds. To keep the model structure under the existing computing capability, the simulation was segmented into three sections - coaxial connector to transmission line, transmission line alone, and transmission line to ribbon bond, and then the results were assembled to predict the performance of the package. Both small signal measurements and operational tests were performed to verify the design and modeling concepts. The package was operated up to 50 Gb/s with low degradation to input digital waveforms.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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