准确的全芯片估计功率图，电流密度和温度的EM评估

2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) Pub Date : 2014-11-03 DOI:10.1109/ICCAD.2014.7001389

Marko Chew, A. Aslyan, J. Choy, Xin Huang

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引用次数: 5

摘要

全芯片电源接地电迁移评估需要功率图、热图和超过设计规格的红外下降检查。本文概述了获取这些信息所需的三种主要计算操作。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Accurate full-chip estimation of power map, current densities and temperature for EM assessment

Full-chip power ground electro-migration assessment requires a power map, thermal map and checks for IR drops exceeding the design specifications. This paper provides a survey of the three main computation operations required to get these information.

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来源期刊

2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

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