{"title":"三维SOI电路的结构与性能","authors":"R. Zhang, K. Roy, D. Janes","doi":"10.1109/SOI.1999.819850","DOIUrl":null,"url":null,"abstract":"In this paper, potential three-dimensional SOI CMOS VLSI circuit structures are laid out. Chip area, layout complexities, process costs, and impact on circuit performance are compared and discussed.","PeriodicalId":117832,"journal":{"name":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","volume":"4 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":"{\"title\":\"Architecture and performance of 3-dimensional SOI circuits\",\"authors\":\"R. Zhang, K. Roy, D. Janes\",\"doi\":\"10.1109/SOI.1999.819850\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, potential three-dimensional SOI CMOS VLSI circuit structures are laid out. Chip area, layout complexities, process costs, and impact on circuit performance are compared and discussed.\",\"PeriodicalId\":117832,\"journal\":{\"name\":\"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)\",\"volume\":\"4 3\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"28\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOI.1999.819850\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.1999.819850","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Architecture and performance of 3-dimensional SOI circuits
In this paper, potential three-dimensional SOI CMOS VLSI circuit structures are laid out. Chip area, layout complexities, process costs, and impact on circuit performance are compared and discussed.