{"title":"带有嵌入式电阻的先进Mcm-d","authors":"D. Scheid","doi":"10.1109/ICMCM.1994.753562","DOIUrl":null,"url":null,"abstract":"This paper describes a thin film process that was developed for fabricating a high performance Cu/PI MCM-D with embedded TiW thin film resistors using standard IC equipment, modified to handle square substrates. Several thousand MCM's have been produced with exceptional AC and DC characteristics. These MCM's were attached to a larger MCM-L substrate that functioned as a logic module tester, capable of greater than 600 MHz operation. Each MCM provided for interconnection of 4 large ECL gate arrays, 9 decoupling capacitors and 18 resistor networks. By integrating the resistors into the thin film stack better performance and cost savings could be achieved. This was a result of the reduced parasitics, increased routability and component reduction. The MCM thin film consisted of 8 metal layers (4 routing, 3 power-ground and I for resistor formation) deposited on a glass ceramic substrate. The MGM measures 4.6 cm/sup 2/ and has more than 15 meters of thin film routing available with 2,000 vias/cm/sup 2/.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"229 11","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Advanced Mcm-d With Embedded Resistors\",\"authors\":\"D. Scheid\",\"doi\":\"10.1109/ICMCM.1994.753562\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a thin film process that was developed for fabricating a high performance Cu/PI MCM-D with embedded TiW thin film resistors using standard IC equipment, modified to handle square substrates. Several thousand MCM's have been produced with exceptional AC and DC characteristics. These MCM's were attached to a larger MCM-L substrate that functioned as a logic module tester, capable of greater than 600 MHz operation. Each MCM provided for interconnection of 4 large ECL gate arrays, 9 decoupling capacitors and 18 resistor networks. By integrating the resistors into the thin film stack better performance and cost savings could be achieved. This was a result of the reduced parasitics, increased routability and component reduction. The MCM thin film consisted of 8 metal layers (4 routing, 3 power-ground and I for resistor formation) deposited on a glass ceramic substrate. The MGM measures 4.6 cm/sup 2/ and has more than 15 meters of thin film routing available with 2,000 vias/cm/sup 2/.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"229 11\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753562\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753562","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes a thin film process that was developed for fabricating a high performance Cu/PI MCM-D with embedded TiW thin film resistors using standard IC equipment, modified to handle square substrates. Several thousand MCM's have been produced with exceptional AC and DC characteristics. These MCM's were attached to a larger MCM-L substrate that functioned as a logic module tester, capable of greater than 600 MHz operation. Each MCM provided for interconnection of 4 large ECL gate arrays, 9 decoupling capacitors and 18 resistor networks. By integrating the resistors into the thin film stack better performance and cost savings could be achieved. This was a result of the reduced parasitics, increased routability and component reduction. The MCM thin film consisted of 8 metal layers (4 routing, 3 power-ground and I for resistor formation) deposited on a glass ceramic substrate. The MGM measures 4.6 cm/sup 2/ and has more than 15 meters of thin film routing available with 2,000 vias/cm/sup 2/.
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