Process Modelling And Advanced Design Techniques For A Multi-chip Hybrid Package

Packaging technology has seen the familiar trends of the electronic industry with increasing size and wireability requirements. Along with those requirements come new materials to improve performance and tighter groundrules to increase interconnectivity. These requirements and new materials must be understood in order to insure manufacturability of new products for the marketplace. In IBM, this path is seen in the migration of Thermal conduction module (TCM) made with AI203 (Alumina) ceramic to the new ES9000 T C M made with glass-ceramic (G/C) and thin film. This paper prescnts process modelling and design techniques that assisted IBM in the manufacturing success of this new hybrid technology. The ES9000 T C M is a 127mm square module made of Corderite glass-ceramic that is 63 layers thick. It has up to 121 chip sites with decoupling capacitors a t the corners of the chips (figure I). There are 2772 1/0 pins for power and signal and this substrate can cool up to 2000 watts with it's water cooled cap (figure 2). This substrate supports 14 planc pairs of wiring that can have roughly 400 meters of interconnect wiring. Key features include partial thin film redistribution and buried engineering change (EC) wiring planes to assist in minor EC capability as well as repair. Fig.1. ES/9000 glass-ceramic substrate Fig.2. ES/9000 Module Assembly