多芯片模块封装设计的计算机辅助工具

P. Katragadda, S. Bhattacharya, I. Grosse
{"title":"多芯片模块封装设计的计算机辅助工具","authors":"P. Katragadda, S. Bhattacharya, I. Grosse","doi":"10.1109/ICWSI.1994.291260","DOIUrl":null,"url":null,"abstract":"The inherent expertise, complexity and human time involved in finite element modeling and analysis (FEMA) has been currently limited in its application as a tool for early design evaluation. Yet it is possible to overcome these drawbacks and offer engineers a finite element based design tool for rapid design evaluation by simply applying proven artificial intelligence technology, feature based modeling and object oriented techniques to streamline and automate the finite element modeling and analysis as much as possible. Finally, the concepts espoused by Taguchi and others for high quality manufacturing processes can also be applied to advanced package design in a computer based environment. In this manner the design space for advanced package design can be efficiently explored early in the design process and the most promising package configuration in terms of performance and robustness can be selected for prototyping and testing. The authors propose a computer based design tool for multichip modules which embodies these ideas.<<ETX>>","PeriodicalId":183733,"journal":{"name":"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)","volume":" 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A computer-aided tool for multichip module package design\",\"authors\":\"P. Katragadda, S. Bhattacharya, I. Grosse\",\"doi\":\"10.1109/ICWSI.1994.291260\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The inherent expertise, complexity and human time involved in finite element modeling and analysis (FEMA) has been currently limited in its application as a tool for early design evaluation. Yet it is possible to overcome these drawbacks and offer engineers a finite element based design tool for rapid design evaluation by simply applying proven artificial intelligence technology, feature based modeling and object oriented techniques to streamline and automate the finite element modeling and analysis as much as possible. Finally, the concepts espoused by Taguchi and others for high quality manufacturing processes can also be applied to advanced package design in a computer based environment. In this manner the design space for advanced package design can be efficiently explored early in the design process and the most promising package configuration in terms of performance and robustness can be selected for prototyping and testing. The authors propose a computer based design tool for multichip modules which embodies these ideas.<<ETX>>\",\"PeriodicalId\":183733,\"journal\":{\"name\":\"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)\",\"volume\":\" 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-01-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1994.291260\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1994.291260","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

有限元建模与分析(FEMA)固有的专业知识、复杂性和人力时间限制了其作为早期设计评估工具的应用。然而,通过简单地应用成熟的人工智能技术、基于特征的建模和面向对象的技术,尽可能地简化和自动化有限元建模和分析,可以克服这些缺点,为工程师提供基于有限元的快速设计评估设计工具。最后,田口和其他人支持的高质量制造过程的概念也可以应用于基于计算机的环境中的高级包装设计。通过这种方式,可以在设计过程的早期有效地探索先进封装设计的设计空间,并且可以选择在性能和健壮性方面最有希望的封装配置进行原型设计和测试。作者提出了一个基于计算机的多芯片模块设计工具,体现了这些思想。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A computer-aided tool for multichip module package design
The inherent expertise, complexity and human time involved in finite element modeling and analysis (FEMA) has been currently limited in its application as a tool for early design evaluation. Yet it is possible to overcome these drawbacks and offer engineers a finite element based design tool for rapid design evaluation by simply applying proven artificial intelligence technology, feature based modeling and object oriented techniques to streamline and automate the finite element modeling and analysis as much as possible. Finally, the concepts espoused by Taguchi and others for high quality manufacturing processes can also be applied to advanced package design in a computer based environment. In this manner the design space for advanced package design can be efficiently explored early in the design process and the most promising package configuration in terms of performance and robustness can be selected for prototyping and testing. The authors propose a computer based design tool for multichip modules which embodies these ideas.<>
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