{"title":"国产高压器件中PBTI的研究","authors":"B. Tsai, Z. Peng, H. Chuang, C. F. Chen, C. Hsu","doi":"10.1109/IPFA47161.2019.8984914","DOIUrl":null,"url":null,"abstract":"The native HV device (w/o Vt implantation) and regular HV device (w/i Vt implantation) of PBTI Vt shift behaviors are investigated in this paper, and an envisioned mechanism is provided. Native HV device showed a high Vt shift at the beginning of Vg stress, the Ig-Vg curve measured supported this observation; also, the mismatch characterizations were also measured and compared in both native and regular HV devices.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"2 8","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"PBTI Study in Native High Voltage Device\",\"authors\":\"B. Tsai, Z. Peng, H. Chuang, C. F. Chen, C. Hsu\",\"doi\":\"10.1109/IPFA47161.2019.8984914\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The native HV device (w/o Vt implantation) and regular HV device (w/i Vt implantation) of PBTI Vt shift behaviors are investigated in this paper, and an envisioned mechanism is provided. Native HV device showed a high Vt shift at the beginning of Vg stress, the Ig-Vg curve measured supported this observation; also, the mismatch characterizations were also measured and compared in both native and regular HV devices.\",\"PeriodicalId\":169775,\"journal\":{\"name\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"2 8\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA47161.2019.8984914\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984914","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The native HV device (w/o Vt implantation) and regular HV device (w/i Vt implantation) of PBTI Vt shift behaviors are investigated in this paper, and an envisioned mechanism is provided. Native HV device showed a high Vt shift at the beginning of Vg stress, the Ig-Vg curve measured supported this observation; also, the mismatch characterizations were also measured and compared in both native and regular HV devices.