{"title":"可靠的超深亚微米互连网格","authors":"A. Namazi, M. Nourani, M. Saquib","doi":"10.1109/DCAS.2006.321045","DOIUrl":null,"url":null,"abstract":"Reliability of the interconnects has become a challenge in deep submicron technology. In this paper, we propose grid communication strategy that establishes highly reliable interconnects with no length limitation. We show that using direct sequence spread spectrum and inexpensive transceivers we can transfer data with extremely low error rates. Such a highly reliable communication network is vital for future ultra deep submicron and nano systems. Experimental results are also reported to verify the concept, clarify the design procedure and measure the communication grid metrics","PeriodicalId":244429,"journal":{"name":"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software","volume":"09 6","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Reliable Interconnect Grid for Ultra Deep Submicron\",\"authors\":\"A. Namazi, M. Nourani, M. Saquib\",\"doi\":\"10.1109/DCAS.2006.321045\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Reliability of the interconnects has become a challenge in deep submicron technology. In this paper, we propose grid communication strategy that establishes highly reliable interconnects with no length limitation. We show that using direct sequence spread spectrum and inexpensive transceivers we can transfer data with extremely low error rates. Such a highly reliable communication network is vital for future ultra deep submicron and nano systems. Experimental results are also reported to verify the concept, clarify the design procedure and measure the communication grid metrics\",\"PeriodicalId\":244429,\"journal\":{\"name\":\"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software\",\"volume\":\"09 6\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DCAS.2006.321045\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DCAS.2006.321045","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliable Interconnect Grid for Ultra Deep Submicron
Reliability of the interconnects has become a challenge in deep submicron technology. In this paper, we propose grid communication strategy that establishes highly reliable interconnects with no length limitation. We show that using direct sequence spread spectrum and inexpensive transceivers we can transfer data with extremely low error rates. Such a highly reliable communication network is vital for future ultra deep submicron and nano systems. Experimental results are also reported to verify the concept, clarify the design procedure and measure the communication grid metrics