固溶氧化半导体TFT正偏置应力稳定性机理研究

Haoxin Li, Guangwei Xu, Shibing Long
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引用次数: 0

摘要

在本研究中,我们研究了溶液加工氧化物半导体薄膜晶体管(TFTs)在不同应力栅极电压和温度下的正偏置应力(PBS)稳定性。拉伸指数模型对ΔVon与应力时间数据拟合得很好。我们还使用热化能分析方法对数据进行了分析,发现估计的势垒高度与拉伸指数模型拟合一致。我们将PBS的不稳定性归因于沟道和栅极绝缘体界面处的深界面陷阱。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mechanism study of positive-bias stress stability for solution processed oxide semiconductor TFT
In this study, we investigated the positive bias stress (PBS) stability of solution-processed oxide semiconductor thin-film transistors (TFTs) under different stress gate voltages and temperatures. The ΔVon vs. stress time data were fitted very well by the stretched-exponential model. We also analyzed the data using a thermalization energy analysis method and found estimated barrier heights that agree with the stretched-exponential model fitting. We attributed the PBS instability to the deep interface traps at the interface between channel and gate insulator.
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