宾夕法尼亚州立大学印刷电路板组装/焊接计划

E.A. Lehtihet
{"title":"宾夕法尼亚州立大学印刷电路板组装/焊接计划","authors":"E.A. Lehtihet","doi":"10.1109/IEMT.1992.639884","DOIUrl":null,"url":null,"abstract":"Surface mount technology ( SMT ) is having a significant impact in the printed circuit board industry given implications of this technology on component sizelweight considerations, board density, assembly and testing. Large segments of the industry are converting from through hole technology to surface mount and engineers find they have to master new processes and keep informed of new developments. With initial support from the AT&T Manufacturing Foundation and current support from the National Science Foundation, the Industrial Engineering Department at Penn State has developed a laboratory to support most processes required for assembly of printed circuit boards with mixed technology. This paper provides a brief description of two recent educational initiatives involving this technology as well as other aspects of electronic manufacturing.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Printed Circuit Board Assembly/soldering Initiatives At Penn State\",\"authors\":\"E.A. Lehtihet\",\"doi\":\"10.1109/IEMT.1992.639884\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Surface mount technology ( SMT ) is having a significant impact in the printed circuit board industry given implications of this technology on component sizelweight considerations, board density, assembly and testing. Large segments of the industry are converting from through hole technology to surface mount and engineers find they have to master new processes and keep informed of new developments. With initial support from the AT&T Manufacturing Foundation and current support from the National Science Foundation, the Industrial Engineering Department at Penn State has developed a laboratory to support most processes required for assembly of printed circuit boards with mixed technology. This paper provides a brief description of two recent educational initiatives involving this technology as well as other aspects of electronic manufacturing.\",\"PeriodicalId\":403090,\"journal\":{\"name\":\"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"102 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-09-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1992.639884\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1992.639884","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

表面贴装技术(SMT)对印刷电路板行业产生了重大影响,因为这项技术对元件尺寸、重量、电路板密度、组装和测试都有影响。行业的很大一部分正在从通孔技术转向表面贴装,工程师们发现他们必须掌握新的工艺,并随时了解新的发展。在AT&T制造基金会的最初支持和国家科学基金会的当前支持下,宾夕法尼亚州立大学工业工程系开发了一个实验室,以支持使用混合技术组装印刷电路板所需的大多数过程。本文简要介绍了两项涉及该技术以及电子制造其他方面的最新教育计划。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Printed Circuit Board Assembly/soldering Initiatives At Penn State
Surface mount technology ( SMT ) is having a significant impact in the printed circuit board industry given implications of this technology on component sizelweight considerations, board density, assembly and testing. Large segments of the industry are converting from through hole technology to surface mount and engineers find they have to master new processes and keep informed of new developments. With initial support from the AT&T Manufacturing Foundation and current support from the National Science Foundation, the Industrial Engineering Department at Penn State has developed a laboratory to support most processes required for assembly of printed circuit boards with mixed technology. This paper provides a brief description of two recent educational initiatives involving this technology as well as other aspects of electronic manufacturing.
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