{"title":"底层有电源线/地线的片上传输线的衬底损耗","authors":"A. Tsuchiya, M. Hashimoto, H. Onodera","doi":"10.1109/SPI.2005.1500944","DOIUrl":null,"url":null,"abstract":"This paper discusses shielding effect of power/ground wires in lower layer. A conducting substrate affects characteristics of on-chip transmission line. However in many cases on actual chips, there are P/G wires between the signal wire and the substrate that may shield the substrate coupling. We show measurement and simulation results of on-chip transmission-lines with narrow yet many power/ground wires in a lower layer. Experimental results show that narrow power/ground wires in a lower layer in parallel to the signal wire, which are common in LSI power distribution network, shield substrate coupling and suppress substrate loss. On the other hand, orthogonal power/ground wires in a lower layer hardly mitigate substrate coupling.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Substrate loss of on-chip transmission-lines with power/ground wires in lower layer\",\"authors\":\"A. Tsuchiya, M. Hashimoto, H. Onodera\",\"doi\":\"10.1109/SPI.2005.1500944\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses shielding effect of power/ground wires in lower layer. A conducting substrate affects characteristics of on-chip transmission line. However in many cases on actual chips, there are P/G wires between the signal wire and the substrate that may shield the substrate coupling. We show measurement and simulation results of on-chip transmission-lines with narrow yet many power/ground wires in a lower layer. Experimental results show that narrow power/ground wires in a lower layer in parallel to the signal wire, which are common in LSI power distribution network, shield substrate coupling and suppress substrate loss. On the other hand, orthogonal power/ground wires in a lower layer hardly mitigate substrate coupling.\",\"PeriodicalId\":182291,\"journal\":{\"name\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2005.1500944\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2005.1500944","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Substrate loss of on-chip transmission-lines with power/ground wires in lower layer
This paper discusses shielding effect of power/ground wires in lower layer. A conducting substrate affects characteristics of on-chip transmission line. However in many cases on actual chips, there are P/G wires between the signal wire and the substrate that may shield the substrate coupling. We show measurement and simulation results of on-chip transmission-lines with narrow yet many power/ground wires in a lower layer. Experimental results show that narrow power/ground wires in a lower layer in parallel to the signal wire, which are common in LSI power distribution network, shield substrate coupling and suppress substrate loss. On the other hand, orthogonal power/ground wires in a lower layer hardly mitigate substrate coupling.