底层有电源线/地线的片上传输线的衬底损耗

A. Tsuchiya, M. Hashimoto, H. Onodera
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引用次数: 1

摘要

本文讨论了下层电源/地线的屏蔽作用。导电衬底影响片上传输线的特性。然而,在实际芯片的许多情况下,在信号线和衬底之间有P/G线,可以屏蔽衬底耦合。我们展示了在片上传输线的测量和仿真结果,在较低的层中有窄而多的电源/地线。实验结果表明,在LSI配电网络中,较低一层的窄电源/地线与信号线平行,可以屏蔽衬底耦合,抑制衬底损耗。另一方面,在较低的层中,正交的电源/地线很难减轻衬底耦合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Substrate loss of on-chip transmission-lines with power/ground wires in lower layer
This paper discusses shielding effect of power/ground wires in lower layer. A conducting substrate affects characteristics of on-chip transmission line. However in many cases on actual chips, there are P/G wires between the signal wire and the substrate that may shield the substrate coupling. We show measurement and simulation results of on-chip transmission-lines with narrow yet many power/ground wires in a lower layer. Experimental results show that narrow power/ground wires in a lower layer in parallel to the signal wire, which are common in LSI power distribution network, shield substrate coupling and suppress substrate loss. On the other hand, orthogonal power/ground wires in a lower layer hardly mitigate substrate coupling.
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