{"title":"探讨三维片上网络的低成本层间通信方案","authors":"A. Rahmani, P. Liljeberg, J. Plosila, H. Tenhunen","doi":"10.1109/CADS.2010.5623588","DOIUrl":null,"url":null,"abstract":"In this paper, a low-cost 3D NoC architecture based on Bidirectional Bisynchronous Vertical Channels (BBVC) is proposed as a solution to mitigate high area footprints of vertical interconnects. Dynamically self-configurable BBVCs, which can transmit flits in either direction, enable a system to benefit from a high-speed bidirectional channel instead of a pair of unidirectional channels for inter-layer communication. In this architecture, low-latency attribute of the interconnect TSVs enables the system to support a higher frequency for vertical channels, better bandwidth utilization, lower area footprint, and improved routability. In addition, an enhanced BBVC-based communication scheme, called Direct Vertical Channel Access, is presented to enable an express inter-layer communication. Experimental results verify that the proposed architecture can reduce up to 47% TSV area footprint with a negligible performance degradation.","PeriodicalId":145317,"journal":{"name":"2010 15th CSI International Symposium on Computer Architecture and Digital Systems","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Exploring a low-cost inter-layer communication scheme for 3D networks-on-chip\",\"authors\":\"A. Rahmani, P. Liljeberg, J. Plosila, H. Tenhunen\",\"doi\":\"10.1109/CADS.2010.5623588\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a low-cost 3D NoC architecture based on Bidirectional Bisynchronous Vertical Channels (BBVC) is proposed as a solution to mitigate high area footprints of vertical interconnects. Dynamically self-configurable BBVCs, which can transmit flits in either direction, enable a system to benefit from a high-speed bidirectional channel instead of a pair of unidirectional channels for inter-layer communication. In this architecture, low-latency attribute of the interconnect TSVs enables the system to support a higher frequency for vertical channels, better bandwidth utilization, lower area footprint, and improved routability. In addition, an enhanced BBVC-based communication scheme, called Direct Vertical Channel Access, is presented to enable an express inter-layer communication. Experimental results verify that the proposed architecture can reduce up to 47% TSV area footprint with a negligible performance degradation.\",\"PeriodicalId\":145317,\"journal\":{\"name\":\"2010 15th CSI International Symposium on Computer Architecture and Digital Systems\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 15th CSI International Symposium on Computer Architecture and Digital Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CADS.2010.5623588\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 15th CSI International Symposium on Computer Architecture and Digital Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CADS.2010.5623588","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Exploring a low-cost inter-layer communication scheme for 3D networks-on-chip
In this paper, a low-cost 3D NoC architecture based on Bidirectional Bisynchronous Vertical Channels (BBVC) is proposed as a solution to mitigate high area footprints of vertical interconnects. Dynamically self-configurable BBVCs, which can transmit flits in either direction, enable a system to benefit from a high-speed bidirectional channel instead of a pair of unidirectional channels for inter-layer communication. In this architecture, low-latency attribute of the interconnect TSVs enables the system to support a higher frequency for vertical channels, better bandwidth utilization, lower area footprint, and improved routability. In addition, an enhanced BBVC-based communication scheme, called Direct Vertical Channel Access, is presented to enable an express inter-layer communication. Experimental results verify that the proposed architecture can reduce up to 47% TSV area footprint with a negligible performance degradation.