多开关门的显性衬底噪声耦合机制

E. Salman, E. Friedman, R. Secareanu, O. Hartin
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引用次数: 3

摘要

基于物理直观模型,确定了多开关门的主导衬底噪声耦合机制。与SPICE相比,该模型具有合理的精度。根据该模型描述了地耦合和源/漏耦合占主导地位的区域。研究了上升时间、开关门数、去耦电容、寄生电感等参数对主导噪声耦合机制的影响。如果使用足够的去耦电容或电路表现出低寄生电感(如倒装封装),则通常假设的大规模电路中地耦合的优势被证明是无效的。基于优势噪声分析模型的应用,讨论了几种降噪技术的降噪效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dominant Substrate Noise Coupling Mechanism for Multiple Switching Gates
The dominant substrate noise coupling mechanism is determined for multiple switching gates based on a physically intuitive model. The model exhibits reasonable accuracy as compared to SPICE. The regions where ground coupling and source/drain coupling dominate are described based on this model. The impact of multiple parameters such as the rise time, number of switching gates, decoupling capacitance, and parasitic inductance on the dominant noise coupling mechanism is investigated. The dominance of ground coupling in large scale circuits, as generally assumed, is shown to be invalid if sufficient decoupling capacitance is used or the circuit exhibits a low parasitic inductance such as a flip-chip package. The efficacy of several noise reduction techniques is discussed based on the application of the dominant noise analysis model.
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