以电路性能为重点的SiGe HBTs的电热限制和器件退化

S. Frégonèse, C. Mukherjee, H. Rücker, P. Chevalier, G. Fischer, D. Céli, M. Deng, M. Couret, F. Marc, C. Maneux, T. Zimmer
{"title":"以电路性能为重点的SiGe HBTs的电热限制和器件退化","authors":"S. Frégonèse, C. Mukherjee, H. Rücker, P. Chevalier, G. Fischer, D. Céli, M. Deng, M. Couret, F. Marc, C. Maneux, T. Zimmer","doi":"10.1109/BCICTS50416.2021.9682476","DOIUrl":null,"url":null,"abstract":"This paper examines the performance of SiGe HBTs under DC and AC pulsed operating conditions beyond the breakdown voltage. Two state-of-the-art technologies are investigated. The limitations when biasing the transistor at or beyond peak fT are thermal only, thus penalizing deep trench architectures. Furthermore, the reliability implications are explored and their impact on device degradation is assessed.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Electro-Thermal Limitations and Device Degradation of SiGe HBTs with Emphasis on Circuit Performance\",\"authors\":\"S. Frégonèse, C. Mukherjee, H. Rücker, P. Chevalier, G. Fischer, D. Céli, M. Deng, M. Couret, F. Marc, C. Maneux, T. Zimmer\",\"doi\":\"10.1109/BCICTS50416.2021.9682476\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper examines the performance of SiGe HBTs under DC and AC pulsed operating conditions beyond the breakdown voltage. Two state-of-the-art technologies are investigated. The limitations when biasing the transistor at or beyond peak fT are thermal only, thus penalizing deep trench architectures. Furthermore, the reliability implications are explored and their impact on device degradation is assessed.\",\"PeriodicalId\":284660,\"journal\":{\"name\":\"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/BCICTS50416.2021.9682476\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BCICTS50416.2021.9682476","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文研究了SiGe hbt在超过击穿电压的直流和交流脉冲工作条件下的性能。研究了两种最先进的技术。当偏置晶体管在峰值fT或超过峰值fT时,限制仅是热的,因此不利于深沟槽架构。此外,还探讨了可靠性影响及其对器件退化的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electro-Thermal Limitations and Device Degradation of SiGe HBTs with Emphasis on Circuit Performance
This paper examines the performance of SiGe HBTs under DC and AC pulsed operating conditions beyond the breakdown voltage. Two state-of-the-art technologies are investigated. The limitations when biasing the transistor at or beyond peak fT are thermal only, thus penalizing deep trench architectures. Furthermore, the reliability implications are explored and their impact on device degradation is assessed.
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