纯银表面层上氧化Ag-Sn-In材料

Shen Yuan-Shou, A.M. Lima
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引用次数: 3

摘要

Ag-Sn-Al内氧化合金的缺点之一是氧化后的材料表面总会出现一层纯银。虽然纯银层的厚度仅在0.0002到0.001英寸之间变化。(0.005 ~ 0.025 mm),在开关操作的早期,银层总是引起轻粘焊。其严重程度取决于设备的机械设计以及电流。在光学显微镜下观察了几种银合金的表面,然后用标准金相法对其横截面进行了研究。研究发现,通过从一侧氧化Ag-Sn-In材料,可以消除材料表面的一个纯银。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Pure silver surface layer on the oxidized Ag-Sn-In material
One of the drawbacks of internally oxidized Ag-Sn-Al alloy is that a pure silver layer always appears on the oxidized material surface after oxidation. Although the thickness of the pure silver layer varies only between 0.0002 and 0.001 in. (0.005 to 0.025 mm), the silver layer always causes light tack welding in the early stage of a switching operation. The severity depends on the device's mechanical design as well as the electric current. The surfaces of several Ag alloys were examined under an optical microscope and cross sections were then taken and investigated by the standard metallography method. It is found that one pure silver surface of the Ag-Sn-In material can be eliminated by oxidizing the material from one side.<>
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