用于射频应用的高q可调微机械电容器,具有可移动的电介质

Jun‐Bo Yoon, C. Nguyen
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引用次数: 87

摘要

使用ic兼容的电镀金属表面微加工技术实现了高Q可调谐微机械电容器,并证明其质量(Q-)因子超过290-这是迄今为止报道的频率接近1ghz的片上可调谐电容器的最高水平。在这个设计中,使如此高的片上Q成为可能的关键特征是电容调谐的方法,在这个设计中,它是基于在电容器板之间移动电介质,而不是像以前的设计那样移动板本身。该设计的一个版本在1 GHz (C=1.21 pF)下的测量Q为291,在10 V控制电压下的调谐范围为7.7%,预期自谐振频率(SRF)为19 GHz。在另一种设计中,在10 V上调谐范围更宽,达到40%,在1 GHz (C=1.14 pF)时Q为218。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A high-Q tunable micromechanical capacitor with movable dielectric for RF applications
A high-Q, tunable, micromechanical capacitor has been realized using an IC-compatible, electroplated-metal surface micromachining technology and demonstrated with quality (Q-) factors in excess of 290-the highest reported to date for on-chip tunable capacitors at frequencies near 1 GHz. The key feature in this design that makes possible such high on-chip Q is the method for capacitive tuning, which in this design is based on moving the dielectric between the capacitor plates, rather than moving the plates themselves, as done in previous designs. One version of this design achieves a measured Q of 291 at 1 GHz (C=1.21 pF) with a tuning range of 7.7% over 10 V of control voltage, and an expected self-resonant frequency (SRF) of 19 GHz. In another design, with a wider tuning range of 40% over 10 V, a Q of 218 is achieved at 1 GHz (C=1.14 pF).
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